Our client is a tier-one semiconductor equipment manufacturer whose advanced packaging and test platforms are deployed at leading fabs worldwide. With a strong IP position and a growing pipeline of next-generation engagements, the company is investing heavily in its US development organisation.
Role summary: Lead R&D teams to accelerate development cycles, ensure manufacturability, and collaborate with customers to deliver differentiated semiconductor equipment.
Key responsibilities:
- Manage cross-functional engineering teams (process, mechanical, electrical, firmware);
- Define product roadmaps aligned with customer roadmaps;
- Oversee prototyping, qualification, and transfer to volume manufacturing;
- Engage with key strategic customers and fab partners;
- Maintain IP strategy and quality standards.
Candidate profile:
- Advanced degree in Electrical Engineering, Materials Science or similar;
- 10+ years in semiconductor equipment development;
- Track record of shipped products and customer collaboration;
- Strong leadership and communication skills.
What’s offered:
- Competitive base salary ;
- Annual cash bonus (target 20%);
- Restricted Stock Unit (RSU) grant with a four-year vesting schedule;
- Employee Stock Purchase Plan (ESPP) with 15% discount;
- Best-in-class health benefits: medical, dental, vision and mental health coverage;
- 401(k) with employer match and financial planning support;
- Defined career progression to VP Engineering with executive coaching support.